Copy it into your doc, or print this page. Every field carries a plain-English hint.
1.0 Board & program
Board / application____________ (what it does and where it lives)
Quantity____________ (prototype run vs. production changes the fab class)
Board size____________ (outline dimensions)
Key components____________ (the hardest things to place — BGAs, connectors, power parts)
Signal class____________ (digital, analog, RF, power — or a mix)
2.0 Stackup & electrical
Layer count____________ (2, 4, 6… and the arrangement if you know it)
Copper weight____________ (1 oz standard; heavier for current)
Controlled impedance____________ (which nets, what impedance — or 'none')
Min trace/space____________ (if your layout pushes below fab standard)
3.0 Fab & assembly
Surface finish____________ (ENIG for fine-pitch/BGA, HASL for cheap and simple)
IPC class____________ (Class 2 commercial, Class 3 when failure isn't an option)
Assembly____________ (SMT one side or both, any through-hole)
Environment____________ (operating temp range, vibration, conformal coating)
4.0 Standards baseline
Fabrication____________ (IPC-6012, acceptance to IPC-A-600)
Assembly____________ (IPC-A-610, class per above)